DocumentCode :
2559257
Title :
Selectivity investigation of HfO2 to oxide using wet etching
Author :
Kang, Tsung-Kuei ; Wang, Chih-Cheng ; Tsui, Bing-Yue ; Li, Yuan-Hsin
Author_Institution :
Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
fYear :
2004
fDate :
9-10 Sept. 2004
Firstpage :
87
Lastpage :
90
Abstract :
Experiments indicate that higher HfO2/oxide etching selectivity in IPA/HF solution as compared to DI water/HF solution. Although DI water/HF solution is acceptable for some HfO2 and CVD oxide films, from an integration point of view, the process window is smaller than IPA/HF solution. It is believed that adequately damaged HfO2 and annealed CVD oxides will result in considerably high HfO2/CVD oxide etching selectivity in IPA/HF solution.
Keywords :
annealing; chemical vapour deposition; dielectric thin films; etching; hafnium compounds; semiconductor device manufacture; semiconductor technology; CVD oxide films; HfO2; oxide etching selectivity; wet etching; Atherosclerosis; Bonding; Hafnium oxide; Plasma applications; Plasma chemistry; Plasma density; Plasma measurements; Sputter etching; Sputtering; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Print_ISBN :
0-7803-8469-5
Type :
conf
DOI :
10.1109/SMTW.2004.1393729
Filename :
1393729
Link To Document :
بازگشت