• DocumentCode
    2559979
  • Title

    A SoC with 3.9mW 3Mbps UHF transmitter and 240μW MCU for capsule endoscope with bidirectional communication

  • Author

    Jiang, Hanjun ; Li, Fule ; Chen, Xinkai ; Ning, Yanqing ; Xu Zhang ; Zhang, Xu ; Ma, Teng ; Wang, ZhiHua

  • Author_Institution
    Inst. of Microelectron., Tsinghua Univ., Beijing, China
  • fYear
    2010
  • fDate
    8-10 Nov. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    An ultra-low-power system-on-a-chip (SoC) for wireless capsule endoscopes has been implemented, providing bidirectional communication between the capsule and the external data logger. The SoC is composed of a programmable UHF band transceiver with 3Mbps MSK transmitting and 64kbps OOK receiving, a 1.2V MCU with a dedicated image compressor, multiple on-chip voltage regulators, and etc. The SoC can work with a power supply down to 2.5V. The 3Mbps transmitter working at 400MHz band consumes only 3.9mW power, and the MCU draws only 200μ A current from 1.2V supply. Fabricated in 0.18μm CMOS, the SoC occupies a die area of 13.3mm2 including the I/O pads. A capsule endoscope prototype has been developed using this SoC plus an image sensor. With this SoC, the capsule endoscope can capture 512*512 gastrointestinal images with a frame rate of up to 3 fps.
  • Keywords
    body sensor networks; data compression; endoscopes; image sensors; radio transmitters; system-on-chip; MCU; MSK; OOK; SoC; UHF transmitter; bandwidth 400 MHz; bidirectional communication; bit rate 3 Mbit/s; current 200 muA; external data logger; gastrointestinal images; image compressor; image sensor; power 240 muW; power 3.9 mW; programmable UHF band transceiver; ultra-low-power system-on-a-chip; wireless capsule endoscopes; Bidirectional control; Endoscopes; Image coding; System-on-a-chip; Transceivers; Transmitters; Wireless communication; Capsule endoscope; SoC; low power; transceiver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Circuits Conference (A-SSCC), 2010 IEEE Asian
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-8300-6
  • Type

    conf

  • DOI
    10.1109/ASSCC.2010.5716600
  • Filename
    5716600