Title :
Efficient computation of capacitive coupling between planar and cylindrical interconnections
Author :
Ki Jin Han ; Swaminathan, M.
Author_Institution :
Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
Abstract :
For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.
Keywords :
integrated circuit interconnections; 3D path-finding methodology; capacitive coupling; computational cost reduction; cylindrical interconnections; cylindrical structures; double-exponential transformation; global adaptive quadrature; planar interconnections; planar structures; trapezoidal quadrature; Biological system modeling; Computational modeling; Finite element analysis; Inductance; Packaging; Periodic structures; Transforms;
Conference_Titel :
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
Conference_Location :
Bangalore
DOI :
10.1109/EDAPS.2014.7030803