Increasing Efficiency of a Chemical-Mechanical Polishing of the Silicon Wafer

Author

Khmelev, Vladimir N. ; Shalunov, Andrey V. ; Smerdina, Elena S.

Author_Institution

Biysk Technol. Inst., I.I. Polzunov Altay State Tech. Univ., Biysk

fYear

2006

fDate

1-5 July 2006

Firstpage

263

Lastpage

269

Abstract

The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process

Keywords

chemical mechanical polishing; spraying; ultrasonic cleaning; ultrasonic devices; CMP; chemical-mechanical polishing; polishing liquid; semiconductor manufacturing; silicon wafer; ultrasonic apparatus; ultrasonic devices; ultrasonic spraying; Abrasives; Chemical elements; Chemical industry; Chemical processes; Chemical technology; Lithography; Manufacturing processes; Semiconductor device manufacture; Silicon; Spraying; Semiconductors; chemical mechanical polishing; ultrasonic devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices and Materials, 2006. Proceedings. 7th Annual 2006 International Workshop and Tutorials on

Conference_Location

Erlagol, Altai

ISSN

1815-3712

Print_ISBN

5-7782-0646-1

Type

conf

DOI

10.1109/SIBEDM.2006.231297

Filename

1694106