• DocumentCode
    256156
  • Title

    Challenges of using flex cables in high speed serial links

  • Author

    Anand, G. ; Kumar, V. ; Vasa, M. ; Mutnury, B.

  • Author_Institution
    Dell Enterprise Server Group, Bangalore, India
  • fYear
    2014
  • fDate
    14-16 Dec. 2014
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    Blade servers are constantly moving towards higher data rates and smaller form factor resulting in complex routing choices to accommodate various chassis configurations. Flexible printed circuit (FPC) cables or flex cables serve as a good choice for interconnect medium in such densely configured server systems. In this paper, various challenges involved in designing a high speed serial link using flex cables are discussed. The impact of flex cable stack-up choice on signal integrity (SI) performance (impedance and loss) is studied. Sensitivity analysis on flex cable impedance and loss are performed by taking various flex cable design parameters into account using 3-D full wave modeling results. Best design practices needed for FPC cables are discussed in detail. Finally, SATA 3.0 interface is used as an example to demonstrate the design trade-offs of flex cable.
  • Keywords
    cables (electric); flexible electronics; printed circuits; system buses; 3D full wave modeling; FPC cables; SATA 3.0 interface; SI performance; densely configured server systems; flexible printed circuit cables; high speed serial links; interconnect medium; signal integrity performance; Conductors; Dielectrics; Flexible printed circuits; Impedance; Insulators; Materials; Routing; SATA; flex cable; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
  • Conference_Location
    Bangalore
  • Type

    conf

  • DOI
    10.1109/EDAPS.2014.7030820
  • Filename
    7030820