DocumentCode
256156
Title
Challenges of using flex cables in high speed serial links
Author
Anand, G. ; Kumar, V. ; Vasa, M. ; Mutnury, B.
Author_Institution
Dell Enterprise Server Group, Bangalore, India
fYear
2014
fDate
14-16 Dec. 2014
Firstpage
49
Lastpage
52
Abstract
Blade servers are constantly moving towards higher data rates and smaller form factor resulting in complex routing choices to accommodate various chassis configurations. Flexible printed circuit (FPC) cables or flex cables serve as a good choice for interconnect medium in such densely configured server systems. In this paper, various challenges involved in designing a high speed serial link using flex cables are discussed. The impact of flex cable stack-up choice on signal integrity (SI) performance (impedance and loss) is studied. Sensitivity analysis on flex cable impedance and loss are performed by taking various flex cable design parameters into account using 3-D full wave modeling results. Best design practices needed for FPC cables are discussed in detail. Finally, SATA 3.0 interface is used as an example to demonstrate the design trade-offs of flex cable.
Keywords
cables (electric); flexible electronics; printed circuits; system buses; 3D full wave modeling; FPC cables; SATA 3.0 interface; SI performance; densely configured server systems; flexible printed circuit cables; high speed serial links; interconnect medium; signal integrity performance; Conductors; Dielectrics; Flexible printed circuits; Impedance; Insulators; Materials; Routing; SATA; flex cable; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
Conference_Location
Bangalore
Type
conf
DOI
10.1109/EDAPS.2014.7030820
Filename
7030820
Link To Document