DocumentCode
256159
Title
Methodology to design SATA 3.0 channels with re-driver
Author
Kumar, V. ; Anand, G. ; Mutnury, B. ; Kumar, S.
Author_Institution
Dell Enterprise Server Group, Bangalore, India
fYear
2014
fDate
14-16 Dec. 2014
Firstpage
53
Lastpage
56
Abstract
As signal speeds continue to increase, maintaining signal quality has become a greater challenge for signal integrity (SI) engineers. Migrating a system to a next-generation interface technology operating at higher speeds brings with it increased sensitivity to attenuation and jitter that can severely curtail reach and reliability. In order to meet the interface specification, expensive choices such as low loss material and expensive connectors are needed. Addition of re-drivers to a channel is becoming a popular and relatively in-expensive solution to enhance SI performance. The selection of re-drivers presents some of design and simulation challenges over high speed channels. This paper describes a methodology which enables SI engineers to effectively simulate a SATA 3.0 channel with re-drivers. The proposed methodology is further implemented in one of the server systems to evaluate the data correctness for re-driver usage in the high speed SATA channel. Simulation and measurement data are correlated to validate the effectiveness of re-driver simulation. A Design of Experiment (DoE) is created to address the simulation challenges and accuracy of the simulation result. DoE also addresses the statistical analysis to understand the re-driver parameters that impact eye diagram and jitter. Design engineers can use the flow and methodology introduced in this paper to evaluate channel performance for High Volume Manufacturing (HVM) for their proposed topology.
Keywords
design of experiments; device drivers; jitter; peripheral interfaces; reliability; DoE; HVM; SATA 3.0 channel design; SI performance enhancement; attenuation; design of experiment; expensive connectors; high speed SATA channel; high volume manufacturing; interface specification; jitter; low loss material; measurement data; next-generation interface technology; re-driver parameters; reliability; server systems; signal integrity; signal quality; statistical analysis; Analytical models; Backplanes; Bit error rate; Jitter; Silicon; Simulation; Topology; Re-driver; SATA 3.0; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
Conference_Location
Bangalore
Type
conf
DOI
10.1109/EDAPS.2014.7030821
Filename
7030821
Link To Document