High-speed data transmission system based on QPSK scheme in substrate integrated waveguide

Author

Ning Wang ; Xiao-Chun Li ; Xi-Wang Yuan ; Pei Yu ; Xiao-Jian Ma ; Yan Shao ; Jun-Fa Mao

Author_Institution

Key Lab. of Minist. of Educ. for Res. of Design & EMC of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2014

fDate

14-16 Dec. 2014

Firstpage

117

Lastpage

120

Abstract

Substrate integrated waveguide (SIW) is regarded as an available interconnects solution for high-speed data transmission. In this paper, in order to further improve the data rate and bandwidth usage, an SIW interconnect system based on Quadrature Phase Shift Keying (QPSK) modulation and demodulation technique is proposed. The associated theoretical models validate the feasibility of the presented system. A fabricated SIW prototype with 14-28 GHz bandwidth is experimentally evaluated in the developed SIW QPSK data communication system. Experimental results demonstrate that an excellent eye opening and low error rates are obtained with different Pseudo Random Binary Sequence (PRBS) bit sequences at the rate of 10 Gb/s. Compared with traditional mixing modulation scheme, our proposed system can improve transmission rate from 5 Gb/s to 10 Gb/s and achieve error-free operation (BER<;10^-12) with 2⁷-1 pattern.

Keywords

data communication; error statistics; high-speed integrated circuits; integrated circuit interconnections; quadrature phase shift keying; random sequences; substrate integrated waveguides; SIW QPSK data communication system; SIW interconnect system; bandwidth 14 GHz to 28 GHz; high-speed data transmission system; pseudorandom binary sequence bit sequences; quadrature phase shift keying; substrate integrated waveguide; Bandwidth; Bit error rate; Integrated circuit interconnections; Mixers; Phase shift keying; Substrates; Quadrature Phase Shift Keying (QPSK); bit error rate (BER); pseudo random binary sequence (PRBS); substrate integrated waveguide (SIW);

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE

Conference_Location

Bangalore

Type

conf

DOI

10.1109/EDAPS.2014.7030829

Filename

7030829