Dielectric behaviour of polyperyleneimide films

Author

Damaceanu, Mariana-Dana ; Rusu, Radu-Dan ; BRUMA, Maria

Author_Institution

Petru Poni Inst. of Macromol. Chem., Iasi, Romania

Volume

2

fYear

2011

fDate

17-19 Oct. 2011

Firstpage

291

Lastpage

294

Abstract

Thermostable polyimides based on perylenetetracarboxylic dianhydride and aromatic diamines containing oxadiazole rings were prepared and thin films were made therefrom. Dark-red, opaque coatings resulted having strong adhesion to the glass support. The composition of these polyimide films was analysed using X-ray photoelectron spectroscopy (XPS). The dynamo-mechanical and dielectric behaviour of the polyimide films were investigated, as well.

Keywords

X-ray photoelectron spectra; adhesion; casting; coatings; dielectric losses; dielectric relaxation; dielectric thin films; elastic moduli; glass transition; opacity; permittivity; polymer blends; polymer films; X- ray photoelectron spectroscopy; XPS; adhesion; aromatic diamines; copolymers; dielectric constant; dielectric loss; dielectric properties; dynamomechanical properties; glass support; glass transition temperature; opaque coatings; oxadiazole rings; perylenetetracarboxylic dianhydride; polyperyleneimide thin films; storage modulus; thermostable polyimides; Dielectrics; Films; Glass; Plastics; Polyimides; Temperature measurement; Thermal stability; dielectric; oxadiazole; polyperyleneimides; thin film;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference (CAS), 2011 International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-61284-173-1

Type

conf

DOI

10.1109/SMICND.2011.6095795

Filename

6095795