Title :
Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method
Author :
Wang, Yu-Po ; Prakash, Mani
Author_Institution :
Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA
fDate :
29 May-1 Jun 1996
Abstract :
Surface mounted Leadless Chip Carrier (LCC) are standard components used in military avionics and automotive applications. The strains induced in the solder material due to thermal cycling from power up and environmental effects need to be accurately determined in order to predict the reliability of these packages during usage. The electronic packaging field is rich with various methods and schemes for solder joint reliability prediction. However the success these schemes at predicting useful life varies. Reliability studies of LCC 28´s, LCC 68´s and LCC 84´s using the integrated matrix creep method are presented in this paper
Keywords :
creep; environmental testing; integrated circuit packaging; integrated circuit reliability; soldering; surface mount technology; thermal analysis; automotive applications; electronic packaging; environmental effects; integrated matrix creep method; leadless chip carrier assemblies; military avionics; reliability; solder joint reliability prediction; surface mounted LCC; thermal cycling; Aerospace electronics; Assembly; Automotive applications; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Lead; Materials reliability; Military standards; Soldering;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534578
