Title :
A convergence robust method to model snapback for ESD simulation
Author :
Wei, Linpeng ; Gill, Chai Ean ; Li, Weiying ; Wang, Richard ; Zunino, Mike
Author_Institution :
Freescale Semicond. China, Beijing, China
Abstract :
A new behavior modeling method is presented to model ESD protection devices with voltage snapback. It resolves the convergence problem induced by snapback characteristic. The model can pass HBM, MM and TLP transient simulations in SPICE. The reason for convergence robustness is also discussed.
Keywords :
convergence; electrostatic devices; electrostatic discharge; transient analysis; ESD protection device model; ESD simulation; SPICE; TLP transient simulations; behavior modeling method; convergence robust method; voltage snapback model; Computational modeling; Convergence; Electrostatic discharges; Equations; Integrated circuit modeling; Mathematical model; Transient analysis; ESD simulation; convergence; modeling; snapback;
Conference_Titel :
Semiconductor Conference (CAS), 2011 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-61284-173-1
DOI :
10.1109/SMICND.2011.6095819
