Abstract :
The following topics are dealt with: microfabrication techniques; microfluidics; assembly; wireless networked green sensor system; numerical modelling; optoelectronics; RF MEMS transducers; and RF MEMS resonators.
Keywords :
assembling; microfabrication; micromechanical devices; numerical analysis; optoelectronic devices; packaging; resonators; transducers; wireless sensor networks; MEMS; RF MEMS resonators; RF MEMS transducers; assembly; microfabrication techniques; microfluidics; numerical modelling; optoelectronics; wireless networked green sensor system;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7
