Fine-pitch high-density PGA package

Author

Harada, Shingo ; Sugimoto, M. ; Matsuki, H. ; Sumi, Yasushi ; Ueno, Satoshi ; Murakami, Shinsuke

Author_Institution

Fujitsu Ltd., Kawasaki, Japan

fYear

1990

fDate

14-16 Feb. 1990

Firstpage

154

Lastpage

155

Abstract

A 462-pin PGA (pin-grid-array) package that has 636- mu m pin pitch is described. The package substrate and heat sink are made of AlN ceramic. An LSI chip is attached directly on the heat sink. The package has a thermal impedance of less than 0.1 degrees C/W because of the high thermal conductivity of AlN. Further, the thermal coefficients of expansion of AlN and Si are closely matched. The package is 17 mm/sup 2/ and 3.55 mm high. By using 100- mu m-pitch tape-automated-bonding (TAB) technology for both inner lead bonding (ILB) and outer lead bonding (OLB), the maximum size chip mountable on the package is 13.5 mm/sup 2/. The area ratio of package to chip is 1.6, a factor of 3 to 5 better than conventional packages.<>

Keywords

integrated circuit technology; tape automated bonding; 100 micron; 462-pin PGA; AlN ceramic; AlN-Si; LSI chip; TAB; fine pitch type; heat sink; high-density PGA package; inner lead bonding; outer lead bonding; package substrate; pin-grid-array; tape-automated-bonding; thermal coefficients of expansion; thermal conductivity; thermal impedance; Ceramics; Electronics packaging; Fabrication; Heat sinks; Lead; Polyimides; Substrates; Thermal conductivity; Thermal expansion; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 1990. Digest of Technical Papers. 37th ISSCC., 1990 IEEE International

Conference_Location

San Francisco, CA, USA

Type

conf

DOI

10.1109/ISSCC.1990.110173

Filename

110173