DocumentCode :
2566392
Title :
Characteristics of VHF Capacitively Coupled Plasmas in a 300 mm Etch Chamber
Author :
Hebner, G.A. ; Miller, Paul A. ; Barnat, E.V. ; Paterson, Alan ; Holland, J. ; Lill, T.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM
fYear :
2005
fDate :
20-23 June 2005
Firstpage :
106
Lastpage :
106
Abstract :
Summary form only given. We have investigated the characteristics of VHF capacitively coupled plasmas produced in a modified applied materials chamber. The chamber had a 14-inch diameter upper electrode (source) that was driven at 10 to 160 MHz and a 300 mm diameter electrostatic chuck with a ceramic process kit that was driven at 13.56 MHz (bias). Diagnostics employed include RF diagnostics to measure the voltage and current, Bdot probes to measure the spatial magnetic fields, a microwave interferometer to measure the line-integrated electron density, a hairpin microwave resonator to measure the spatially resolved electron density, absorption spectroscopy to determine the argon metastable temperature and density, laser induced fluorescence (LIF) to determine the spatial distribution of the excited species, and spatially resolved optical emission. Scaling of the plasma parameters with frequency, power and pressure, and implications to energy deposition models will be discussed
Keywords :
argon; plasma density; plasma materials processing; plasma probes; plasma sources; plasma temperature; sputter etching; 10 to 160 MHz; 14 inch; 300 mm; Ar; Bdot probes; RF diagnostics; VHF capacitively coupled plasmas; absorption spectroscopy; argon metastable temperature; ceramic process kit; electrostatic chuck; energy deposition; etch chamber; hairpin microwave resonator; laser induced fluorescence; line-integrated electron density; microwave interferometer; spatial magnetic fields; spatially resolved electron density; spatially resolved optical emission; Current measurement; Density measurement; Electrostatic measurements; Etching; Magnetic field measurement; Microwave measurements; Plasma applications; Plasma materials processing; Plasma measurements; Plasma properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on
Conference_Location :
Monterey, CA
ISSN :
0730-9244
Print_ISBN :
0-7803-9300-7
Type :
conf
DOI :
10.1109/PLASMA.2005.359057
Filename :
4198316
Link To Document :
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