DocumentCode
2571389
Title
Commercial success in the MEMS marketplace
Author
Bratter, Robert L.
Author_Institution
Cronos Integrated Microsyst., USA
fYear
2000
fDate
2000
Firstpage
29
Lastpage
30
Abstract
In order to successfully commercialize their technology, MEMS based companies will have to meet the high expectations set by the marketplace. There are four areas that need to be addressed before wide-scale commercialization of MEMS based products can occur: (1) Reliability: basically, the inherent reliability and long-term functioning of MEMS have yet to be proven beyond certain passive devices. However, for many other applications there are not enough MEMS-based products in the field that we can point to in order to alleviate this concern. (2) Manufacturability: not enough world-class MEMS manufacturing facilities have been established, so there are concerns about the ability of the industry to ramp up volumes as in the IC industry. (3) Packaging: for each application area the packaging challenge is different. In addition, packaging costs are usually considerably more expensive than the MEMS device itself. Component customers want to be convinced that these issues are being addressed and viable solutions will be available. (4) New technology: many potential customers are sitting on the fence simply because the technology is new. This is not unique to MEMS but does affect introduction of the technology
Keywords
costing; micromechanical devices; product development; semiconductor device manufacture; semiconductor device packaging; semiconductor device reliability; technology transfer; MEMS based companies; MEMS marketplace; MEMS-based products; commercial success; commercialisation; manufacturability; new technology; packaging costs; product reliability; Accelerometers; Business; Commercialization; Communication industry; Electronics industry; Microelectromechanical devices; Micromechanical devices; Optical switches; Packaging; Telecommunication switching;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMS, 2000 IEEE/LEOS International Conference on
Conference_Location
Kauai, HI
Print_ISBN
0-7803-6257-8
Type
conf
DOI
10.1109/OMEMS.2000.879612
Filename
879612
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