DocumentCode :
2571459
Title :
GaAs-based microelectromechanical waveguide switch
Author :
Spahn, Olga Blum ; Sullivan, Charles ; Burkhart, Jeff ; Tigges, Chris ; Garcia, Ernie
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fYear :
2000
fDate :
2000
Firstpage :
41
Lastpage :
42
Abstract :
We describe a 1×2 waveguide switch which is also a cantilever, fabricated in GaAs-based materials. This switch can be cascaded into 1×N structure. The layout and layer cross section of the waveguide are shown schematically. Actuation is accomplished by electrostatic means, by application of bias between the movable waveguide and static electrodes. This results in 4 μm motion of the cantilevered waveguide in the plane of the wafer. The waveguide consists of 4 μm thick GaAs/AlGaAs layer, while the release layer is composed of 2 μm of Al0.7Ga0.3As. Metal contacts are deposited on a planar substrate prior to waveguide definition. Then 3 μm wide waveguide is defined by RIBE. Photoresist is defined on the areas to be protected against release and sacrificial layer is removed by a HF-based wet etch. After photoresist removal, devices are sublimation dried. Fabrication issues, such as choice of materials, release chemistries and their implications are further discussed. Also, further details of device performance are given
Keywords :
III-V semiconductors; aluminium compounds; electrostatic actuators; gallium arsenide; micro-optics; micromachining; optical fabrication; optical planar waveguides; optical switches; sputter etching; 2 micron; 4 micron; GaAs; GaAs-AlGaAs; RIBE; bias application; cantilevered waveguide; cascaded switch; device performance; electrostatic actuation; microelectromechanical waveguide switch; movable waveguide; photoresist; planar substrate; release chemistries; static electrodes; waveguide loss; wet etch; Chemistry; Electrodes; Electrostatics; Fabrication; Gallium arsenide; Planar waveguides; Protection; Resists; Switches; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical MEMS, 2000 IEEE/LEOS International Conference on
Conference_Location :
Kauai, HI
Print_ISBN :
0-7803-6257-8
Type :
conf
DOI :
10.1109/OMEMS.2000.879617
Filename :
879617
Link To Document :
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