DocumentCode :
2571742
Title :
Advanced 3D RESURF devices for power integrated circuits
Author :
Udrea, Florin
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
Volume :
2
fYear :
2002
fDate :
2002
Firstpage :
229
Abstract :
Power integrated circuits will be an area of high growth in IT and consumer products due to several factors, among which the following play the crucial role: regulations for increased efficiency, the need for smart features and high reliability, reduced size and weight, and all at a reduced unit cost. This paper is concerned with recent trends in high voltage devices for high voltage integrated circuits and in particular the application of the RESURF effect to the third dimension for a significant increase in the breakdown capability of lateral devices. New 3D device concepts are presented in comparison with classical LDMOSFETs and LIGBTs.
Keywords :
power MOSFET; power integrated circuits; power semiconductor diodes; semiconductor device breakdown; silicon-on-insulator; 3D RESURF devices; IT products; LDMOSFET; LIGBT; RESURF effect; consumer products; efficiency regulations; high voltage devices; high voltage integrated circuits; lateral device breakdown capability; power integrated circuits; product size; product unit cost; product weight; reliability; smart features; Breakdown voltage; Consumer products; Costs; Integrated circuit reliability; Integrated circuit technology; Power integrated circuits; Switched-mode power supply; Switches; Switching circuits; Washing machines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
Print_ISBN :
0-7803-7440-1
Type :
conf
DOI :
10.1109/SMICND.2002.1105839
Filename :
1105839
Link To Document :
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