DocumentCode
2572069
Title
Toward an interconnect programmable CMOS substrate for MCMS
Author
Fraile, Marc ; Martínez, Ricardo ; Terés, Lluís
Author_Institution
Departamento de Disefio de Circuitos y Sistemas Integrados, Univ. Autonoma de Barcelona, Spain
Volume
2
fYear
2002
fDate
2002
Firstpage
313
Abstract
Multi-Chip Module (MCM) manufacturing technologies offers a new approach for reducing the size of electronics systems and improving its power consumption and speed. In order to take advantage of this and minimise cost, we should find ways of reusing a substrate in different applications. We have resumed the implementation of first test vehicle and it is presented the developed, characterisation and test of a second prototype (FPS-2M) and some other devices and the environment for test.
Keywords
CMOS integrated circuits; integrated circuit interconnections; integrated circuit manufacture; multichip modules; MCMS; electronics systems size reduction; interconnect programmable CMOS substrate; multi-chip module manufacturing technologies; power consumption; CMOS technology; Ceramics; Circuit testing; Costs; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Prototypes; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
Print_ISBN
0-7803-7440-1
Type
conf
DOI
10.1109/SMICND.2002.1105857
Filename
1105857
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