DocumentCode :
2573178
Title :
Investigating micro-alloyed solders with thermal shock tests
Author :
Garami, Tamás ; Krammer, Olivér
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2012
fDate :
25-28 Oct. 2012
Firstpage :
129
Lastpage :
132
Abstract :
This paper presents how the low Ag content and micro-alloys in solders can influence the quality and the reliability of joints during thermal shock tests. The solder joints of 0603 (1.6 × 0.8 mm) size surface mounted resistors were compared, while the thermal shock cycle number was increased up to 2000 cycles. The low Ag content, micro-alloyed solders, named mSAC1 and mSAC2, were compared to normal SAC305, SAC405 and 62Sn36Pb2Ag solders. Cross-sections were made to measure the Cu3Sn and the Cu6Sn5 intermetallic layers´ average thickness. By inspecting the cross-sections, it is also revealed what kind of typical crack path has formed in the solder joints.
Keywords :
copper alloys; lead alloys; reflow soldering; resistors; silver alloys; surface mount technology; thermal shock; tin alloys; Cu6Sn5; SAC305; SAC405; SnPbAg; crack path; intermetallic layers; joint quality; joint reliability; mSAC1; mSAC2; micro-alloyed solders; size 0.8 mm; size 1.6 mm; solder joints; surface mounted resistors; thermal shock cycle number; thermal shock tests; Electric shock; Intermetallic; Lead; Reliability; Soldering; Tin; intermetallic layer; lead-free; micro-alloyed solders; reliability; thermal shock;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location :
Alba Iulia
Print_ISBN :
978-1-4673-4760-0
Electronic_ISBN :
INAVLID ISBN
Type :
conf
DOI :
10.1109/SIITME.2012.6384361
Filename :
6384361
Link To Document :
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