DocumentCode :
2573861
Title :
Beyond TED: understanding boron shallow junction formation
Author :
Dunham, S.T. ; Chakravarthi, S. ; Gencer, A.H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
501
Lastpage :
504
Abstract :
As implant energies are reduced with the aim of forming shallower junctions, transient enhanced diffusion (TED) effects are greatly reduced. With TED less pronounced, other effects emerge to dominate the diffusion of dopants such as boron. In particular, coupled dopant/defect diffusion injects interstitials leading to enhanced tail diffusion, while oxidation and the diffusion of silicon through thin oxides affects the surface point defect concentrations. This paper shows that by careful consideration of models developed for much deeper junctions, the dependence of junction depth on processing conditions can be understood for shallow junctions as well.
Keywords :
VLSI; boron; diffusion; doping profiles; elemental semiconductors; interstitials; ion implantation; oxidation; silicon; Si:B; coupled dopant/defect diffusion; dopant diffusion; implant energies; interstitials; junction depth; oxidation; processing conditions; shallow junction formation; surface point defect concentrations; tail diffusion; Boron; Computer aided manufacturing; Implants; Lead compounds; Oxidation; Semiconductor process modeling; Silicon; Tail; Temperature; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746407
Filename :
746407
Link To Document :
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