Title :
Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages
Author :
Moon, Sung-Won ; Yang, Cheng ; Li, Zhihua ; Fischer, Anthony
Author_Institution :
Intel Corp., Chandler, AZ
Abstract :
The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow front shape is highly non-uniform around the die stack-up units and is dependent on various design parameters including mold cap clearance, mold compound material properties, as well as the die stack-up geometric configurations. It was demonstrated that validated flow model can help guiding the design, material, and process optimization of 3D packaging development.
Keywords :
chip scale packaging; flow simulation; injection moulding; integrated circuit manufacture; die stack-up units; flow model; geometric configurations; injection molding process; stacked chip scale package; stacked die packages; three dimensional flow analysis; three-dimensional numerical simulation; Design optimization; Electronics packaging; Encapsulation; Equations; Filling; Injection molding; Performance analysis; Process design; Solid modeling; Viscosity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1335-5
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2007.4417049
