• DocumentCode
    2576340
  • Title

    Embedded Capacitor Technology: A Real World Example

  • Author

    Smith, Norm ; Fan, Jun ; Andresakis, John ; Fukawa, Yoshi ; Harvey, Mark ; Knighten, Jim

  • Author_Institution
    Teradata Corp., Dayton, OH
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    118
  • Lastpage
    124
  • Abstract
    Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of buried capacitance layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs.
  • Keywords
    capacitors; printed circuits; surface mount technology; chip decoupling capacitors; embedded capacitor; power distribution system; printed circuit board; surface mount technology; Capacitance measurement; Capacitors; Circuit testing; Measurement standards; Power distribution; Printed circuits; Semiconductor device measurement; Surface-mount technology; System testing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
  • Conference_Location
    San Jose, CA
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-1335-5
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2007.4417064
  • Filename
    4417064