Solder Joint Thermal Fatigue Analysis of 48-FBGA

Author

Chen, Song ; Lee, Taekoo ; Lee, Jaisun ; Feng, Nufeng

Author_Institution

Samsung Semicond. (China) R&D Co.,Lt, Suzhou

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

A three-dimensional finite element model has been developed to study the solder joint reliability of 48-1/0 fine pitch ball-grid-array (FBGA) assembly. Anand model was selected to describe the 62Sn36Pb2Ag creep behavior. Sub-modeling technique was used to transfer the displacements to the local model for a detailed analysis under thermal cycling conditions. Solder ball visco-plastic energy accumulated per temperature cycle was applied in this BGA product to predict the fatigue life. In addition, the effect of PCB thickness was pointed briefly

Keywords

ball grid arrays; fatigue cracks; integrated circuit reliability; lead alloys; silver alloys; solders; thermal stress cracking; tin alloys; viscoplasticity; ANSYS simuation; Anand model; FBGA; SnPbAg; fatigue life; fine pitch ball grid array; solder ball viscoplastic energy; solder joint reliability; thermal fatigue; three-dimentional finite element model; Assembly; Capacitive sensors; Creep; Electronics packaging; Equations; Fatigue; Finite element methods; Silicon; Soldering; Temperature; ANSYS; FBGA; simulation; solder joint; submodel; thermal fatigue; viscoplastic energy;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359816

Filename

4198937