Title :
Anodic Bonding Study on Vacuum Micro Sealing Cavity
Author :
Guan, Rongfeng ; Gan, Zhiyin ; Fulong, Zhu ; Wang, Xuefang ; Liu, Sheng
Author_Institution :
Inst. of Mater. Sci. & Eng., Henan Polytech. Univ., Jiaozuo
Abstract :
In spite of the fact that anodic bonding technique has be extensively utilized in the microelectromechanical systems (MEMS) for the packaging of microsensors and microactuators, some key issues, such as decreasing anodic bonding temperature, improving bonding strength and reducing bubbles in the bonding interface, must be resolved. In the paper, the anodic bonding process of a micro sealing cavity is studied by using an in-house made vacuum packaging equipment. The quality of the anodic bonding interface quality is analyzed by SEM. The shear strength of the bonding samples is measured by a in-house made six-axis micro tester. The analysis results demonstrate that the anodic bonding interfaces are dense, without bubbles, and their shear strength is over 29MPa
Keywords :
bonding processes; electronics packaging; micromechanical devices; scanning electron microscopy; shear strength; vacuum techniques; anodic bonding; bonding strength; microactuators; microelectromechanical systems; microsensors; scanning electron microscopy; shear strength; vacuum micro sealing cavity; vacuum packaging; Bonding processes; Electronics packaging; Glass; Materials science and technology; Packaging machines; Silicon; Temperature; Wafer bonding; Wafer scale integration; Wet etching;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359851
