Experimental Determination of Mechanical Properties for Lead-Free Material SnAgCu

Author

Qiang, Wang ; Lihua, Liang ; Yong, Liu

Author_Institution

MOE Key Lab. of Mech. Manuf. & Autom., Zhejiang Univ. of Technol., Hangzhou

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

A series of tensile tests of 95.5Sn4.0Ag0.5Cu under a wide range of temperatures and constant strain rates are conducted. Base on the test results, empirical equations for predicting tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. From the data of tests, it is found that temperature and strain rate demonstrate crucial effects on tensile and creep properties of SnAgCu material. The tests have disclosed certain viscoplastic behavior, temperature dependence, strain rate sensitivity and creep resistance. Finally, the mechanical properties such as tensile strength, yield stress and viscoplastic behavior are studied

Keywords

copper alloys; creep; elastic moduli; silver alloys; tensile strength; tensile testing; tin alloys; viscoplasticity; yield stress; SnAgCu; creep properties; elastic modulus; lead-free material; mechanical properties; tensile strength; tensile tests; viscoplasticity; yield stress; Conducting materials; Creep; Environmentally friendly manufacturing techniques; Equations; Mechanical factors; Temperature distribution; Temperature sensors; Tensile strain; Tensile stress; Testing; Lead-free material; Viscoplasticity; tensile tests;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359649

Filename

4199007