DocumentCode :
2578819
Title :
High efficiency, high reliability 2 kW inverter for aeronautical application
Author :
Vieillard, S. ; Meuret, R.
Author_Institution :
Rond Point Rene Ravaud, Paris
fYear :
2007
fDate :
2-5 Sept. 2007
Firstpage :
1
Lastpage :
8
Abstract :
In aerospace electrical systems, the design trade off is made by the optimization between 5 main constraints : efficiency, EMI, environment, integration level and reliability. In this paper is presented a power inverter solution that enables a high level of integration and a high level of efficiency. The integration of the power inverter is made in one single module that comprises 3 phase legs and one temperature measurement. This type of assembly enables to reduce the inverter volume by suppressing the use of discrete power components. The temperature cycling made revealed that this packaging assembly can withstand severe aeronautical environment. In the same time, the use of IGBT dies combined to SiC Schottky Diodes allows a 45% reduction on switching losses. The paper will present some tables that summarize the efficiency characterization done on the power module. Finally, this type of module will enable an easiest integration of the inverter in a complete controller environment with an improved reliability. Moreover this is done in a smaller whole volume due to the heat sink shrinking thanks to the improved efficiency.
Keywords :
Schottky diodes; aerospace instrumentation; insulated gate bipolar transistors; invertors; power bipolar transistors; semiconductor device reliability; temperature measurement; thermal management (packaging); IGBT; Schottky diode; SiC; aerospace electrical system; discrete power component; heat sink; packaging assembly; power 2 kW; power inverter reliability; power module; temperature measurement; Assembly; Constraint optimization; Design optimization; Electromagnetic interference; Insulated gate bipolar transistors; Inverters; Leg; Packaging; Power system reliability; Temperature measurement; Aerospace; Converter circuit; Device application; Efficiency; IGBT; Measurement; Reliability; SiC Device;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
Type :
conf
DOI :
10.1109/EPE.2007.4417228
Filename :
4417228
Link To Document :
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