• DocumentCode
    2579010
  • Title

    Nanometer-scale elastic modulus of surfaces and thin films determined using an atomic force microscope

  • Author

    Li, Alex G. ; Burggraf, Larry W. ; Phillips, David M.

  • Author_Institution
    Dept. of Eng. Phys., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
  • fYear
    2009
  • fDate
    2-5 June 2009
  • Firstpage
    104
  • Lastpage
    108
  • Abstract
    A versatile acoustic method using a commercial atomic force microscope (AFM) was developed to measure surface stiffness at nanometer-scales. Calibrated measurements of acoustic reflections at interfaces between the AFM tip and the surfaces of reference and test materials yielded near-surface interfacial stiffness, from which the elastic modulus was determined using a simple contact mechanics model. The utility and versatility of this method were demonstrated by determining elastic modulus relaxation for surfaces and thin films, including a freshly exposed, reconstructing epoxy surface, and by probing depth-dependent elastic modulus for thin polystyrene films on oxidized silicon substrates.
  • Keywords
    acoustic wave reflection; atomic force microscopy; elastic moduli; mechanical contact; mechanical testing; nanomechanics; polymer films; silicon; surface reconstruction; Si; acoustic method; atomic force microscopy; contact mechanics model; epoxy surface reconstruction; nanometer-scale elastic modulus; oxidized silicon substrate; surface interfacial stiffness; thin film; thin polystyrene films; versatile acoustic reflections; Acoustic measurements; Acoustic reflection; Acoustic testing; Atomic force microscopy; Atomic measurements; Force measurement; Materials testing; Mechanical variables measurement; Surface reconstruction; Transistors; Acoustics; Atomic Force Microscopy; Nanomechanics; Surface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2009. NMDC '09. IEEE
  • Conference_Location
    Traverse City, MI
  • Print_ISBN
    978-1-4244-4695-7
  • Electronic_ISBN
    978-1-4244-4696-4
  • Type

    conf

  • DOI
    10.1109/NMDC.2009.5167570
  • Filename
    5167570