DocumentCode
2579155
Title
Fabrication of 3-Dimensional Cu coaxial cable using porous silicon MEMS technology
Author
Duk-Soo Eun ; Young-Min Kim ; Su-Lack Jung ; Jang-Kyoo Shin ; Jong-Hyun Lee
Author_Institution
Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., Taegu, South Korea
fYear
2003
fDate
29-31 Oct. 2003
Firstpage
172
Lastpage
173
Abstract
In this paper we study the fabrication of 3-dimensional Cu coaxial cable by HNA etching, porous silicon micromachining and copper plating.
Keywords
coaxial cables; copper; electroplating; etching; metallic thin films; micromachining; 3D Cu coaxial cable; Cu; Si; copper plating; etching; porous silicon MEMS technology; porous silicon micromachining; Coaxial cables; Copper; Dielectric losses; Dielectric substrates; Electrodes; Etching; Fabrication; Machining; Micromechanical devices; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-040-2
Type
conf
DOI
10.1109/IMNC.2003.1268630
Filename
1268630
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