Title :
Suppression of resonant modes in microwave packages
Author :
Williams, D.F. ; Paananen, D.W.
Author_Institution :
Ball Commun. Syst. Div., Broomfield, CO, USA
Abstract :
Undesirable resonant cavity modes of a metal package are shown to be damped effectively by placing a dielectric substrate coated with a resistive film in the cavity. Theoretical predictions are confirmed experimentally. The application of this technique to a hybrid phase shifter in which coupling to a resonant mode of the package degrades circuit performance is discussed. The undesirable interaction of the phase-shifting circuit and a resonant package mode is shown to be suppressed effectively by the introduction of the lossy film.<>
Keywords :
MMIC; cavity resonators; hybrid integrated circuits; integrated circuit technology; microwave integrated circuits; packaging; resonance; MIC; MMIC; dielectric substrate; hybrid IC; hybrid phase shifter; lossy film; metal package; microwave packages; resistive film coating; resonant cavity modes; resonant modes suppression; resonant package mode; Conductivity; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Inorganic materials; Integrated circuit packaging; MMICs; Q factor; RLC circuits; Resonance;
Conference_Titel :
Microwave Symposium Digest, 1989., IEEE MTT-S International
Conference_Location :
Long Beach, CA, USA
DOI :
10.1109/MWSYM.1989.38956
