Title :
Integration Of Thermally Stable, Low-k AF4 Polymer For 0.18 /spl mu/m Interconnects And Beyond
Author :
Ralston, A.R.K. ; Gaynor, J.F. ; Singh, A. ; Le, L.V. ; Havemann, R.H. ; Piano ; Cleary, T.J. ; Wing, J.C. ; Kelly, J.
Author_Institution :
Semiconductor Process and Device Center, Texas Instruments, PO Box 655012, MS 461, Dallas, Texas 75265
Conference_Titel :
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN :
4-930813-75-1
DOI :
10.1109/VLSIT.1997.623705
