Title :
Experimental characterization methods for power MOSFET assemblies
Author :
Wernicke, Thies ; Dieckerhoff, Sibylle ; Kirfe, Tino ; Feix, Gudrun ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
Tech. Univ. of Berlin, Berlin
Abstract :
In this paper, experimental methods to characterize the electrical and thermal package properties of newly developed MOSFET technology demonstrators are discussed. The electrical measurements focus on the switching characteristics and the stray inductance. From the thermal point of view, the steady-state temperature distribution within the package is measured. Exemplarily, measurement results for the FlipChip on Flex technology applying low-voltage, high current MOSFETs are used for the evaluation.
Keywords :
assembling; flip-chip devices; power MOSFET; semiconductor device measurement; temperature distribution; thermal management (packaging); Flex technology; FlipChip; electrical measurements; power MOSFET assembly; steady-state temperature distribution; stray inductance; switching characteristics; thermal package property; Assembly; Bonding; Electronic packaging thermal management; Flip chip; MOSFET circuits; Power MOSFET; Semiconductor device measurement; Semiconductor device packaging; Semiconductor diodes; Wire; Emerging Technology; MOSFET; Measurement; Packaging; Test Bench;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417633
