Research of Material Properties Reliance for POP with Numerical Analysis

The POP (Package on Package) has been the core technology for high density package in the area of electronics devices, such as Mobile Phone, Digital Camera, Digital Video Camera and Notebook PC. And its utilization has been increased rapidly. The development of the new technology POP has been expected and the most focused concern is the reliability of it. In this paper, the reliance of the material properties on the numerical analysis for the reliability assessment of POP is studied, especially focusing the encapsulant. The result of the numerical analysis with the material properties, that the material supplier announced, did not support the result of the actual hardware testing. Then through the research process, we had focused the material properties, and then we actually measured the material properties with the piece of the actual hardware parts which are constructing this product. As the result, we found the order difference between the material supplier announced data and our measured data. It is recognized strongly that the reliance of the material properties is extremely important. With this established numerical model, we had studied the optimized parameter of the encapsulant.