DocumentCode :
2586787
Title :
Ambient intelligence - key technologies in the information age
Author :
Weber, W. ; Braun, C. ; Glaser, R. ; Gsottberger, Y. ; Halik, M. ; Jung, S. ; Klauk, H. ; Lauterbach, C. ; Schmid, G. ; Shi, X. ; Sturm, T.F. ; Stromberg, G. ; Zschieschang, U.
Author_Institution :
Infineon Technol. AG, Germany
fYear :
2003
fDate :
8-10 Dec. 2003
Abstract :
In this paper, applications are discussed that describe achievements along the road towards ´Ambient Intelligence´. Appliances and devices disappear into the environment of the individual; instead services come into focus. Key to this development are system solutions that lead to a significant improvement of the human-machine interface. Along this line, we present important technologies and key system components ranging from low-cost electronic technologies and systems, to ubiquitous sensor networks and electronics in smart textiles. In conclusion, this presentation relates the semiconductor technology roadmap to a future world in which electronics meets human needs in a pervasive, intuitive and beneficial way.
Keywords :
computer aided instruction; consumer electronics; human computer interaction; integrated circuit packaging; intelligent materials; intelligent networks; intelligent sensors; man-machine systems; semiconductor device packaging; technological forecasting; ubiquitous computing; wearable computers; ambient intelligence; application demonstrators; clothing integrated electronics; distributed intelligence; human-machine interface; key system components; low-cost electronic technologies; low-cost wireless network; packaging concept; personal sensor network; polymer electronics; semiconductor technology roadmap; smart RF ID tags; smart homes; smart textiles; system solutions; technology lifestyle; ubiquitous sensor networks; virtual personal tutor; wearable electronics; Ambient intelligence; Computer peripherals; Consumer electronics; Costs; Hardware; Home appliances; Humans; Paper technology; Pervasive computing; Textile technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
Type :
conf
DOI :
10.1109/IEDM.2003.1269154
Filename :
1269154
Link To Document :
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