• DocumentCode
    2589868
  • Title

    Assessment of Ge n-MOSFETs by quantum simulation

  • Author

    Rahman, A. ; Ghosh, A. ; Lundstrom, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    Quantum simulations of ultra-thin-body (UTB), double-gate (DG), end of the ITRS-2001 roadmap germanium n-MOSFETs are performed using the non-equilibrium Green´s function (NEGF) formalism. Ballistic simulations show that Ge (111) n-MOSFETs suffer from high source-to-drain tunneling in the off-state and low semiconductor capacitance in the on-state. However, devices fabricated on Ge (100) wafers perform better compared to their silicon counterparts. Design optimization studies show that a stiff tolerance for body thickness variations and a super-steep source-drain doping gradient are necessary to optimize the device performance. Finally, it was observed from quantum scattering simulations that the source-drain series resistance limits the otherwise near-ballistic intrinsic device operation.
  • Keywords
    Green´s function methods; MOSFET; ballistic transport; doping profiles; elemental semiconductors; germanium; optimisation; scattering; semiconductor device models; tunnelling; Ge; Ge (100) n-MOSFET; Ge (111) n-MOSFET; NEGF; UTB DGMOSFET; ballistic simulations; body thickness variations tolerance; double gate MOSFET; nonequilibrium Green´s function; optimization; quantum scattering; quantum simulation; semiconductor capacitance; source-drain series resistance; source-to-drain tunneling; super-steep source-drain doping gradient; ultra-thin-body MOSFET; Design optimization; Germanium; Green´s function methods; Immune system; MOSFET circuits; Particle scattering; Quantum capacitance; Semiconductor device doping; Silicon; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269324
  • Filename
    1269324