Power dissipation analysis of memristor for low power integrated circuit applications

Author

Ogata, Haruki ; Takahashi, Yasuhiro ; Sekine, Toshikazu

Author_Institution

Grad. Sch. of Eng., Gifu Univ., Gifu, Japan

fYear

2014

fDate

17-20 Nov. 2014

Firstpage

627

Lastpage

630

Abstract

This paper reports a memory resistance (memristor) behavior for low power integrated circuit applications. The power dissipation of memristor is analyzed by using Simulation Program with Integrated Circuit Emphasis (SPICE). For power dissipation checking, the memristor is driven by some power supplies: sinusoidal, trapezoidal, triangular, and rectangle waveforms. From the SPICE simulation results, we found that the power dissipation which is driven by the triangular supply waveform is smaller as compared with the other power supplies.

Keywords

CMOS integrated circuits; SPICE; low-power electronics; memristor circuits; memristors; SPICE simulation; Simulation Program with Integrated Circuit Emphasis; low power integrated circuit applications; memory resistance behavior; memristor; power dissipation analysis; power supplies waveforms; rectangle supply waveform; sinusoidal supply waveform; trapezoidal supply waveform; triangular supply waveform; CMOS integrated circuits; Integrated circuit modeling; Mathematical model; Memristors; Power dissipation; SPICE; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (APCCAS), 2014 IEEE Asia Pacific Conference on

Conference_Location

Ishigaki

Type

conf

DOI

10.1109/APCCAS.2014.7032859

Filename

7032859