Title :
Design and measurement of matched wire bond and flip chip interconnects for D-band system-in-package applications
Author :
Beer, Sebastian ; Ripka, B. ; Diebold, Sebastian ; Gulan, Heiko ; Rusch, Christian ; Pahl, Philipp ; Zwick, T.
Author_Institution :
Karlsruhe Institute of Technology, Germany
Abstract :
Summary form only given, as follows. This paper reports on possible interconnect solutions between a Silicon MMIC and an off-chip antenna. These shall both be integrated within a plastic package to achieve a 122 GHz system-in-package. Coplanar wire bond and flip chip interconnects are shortly introduced and compared. Simulation and measurement results of matched interconnects are then evaluated in a frequency range between 110 and 170 GHz.
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2011.5973141