DocumentCode :
2591484
Title :
Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project
Author :
Artaki, Iris ; Noctor, Donna ; Mather, John ; Schroeder, Scott ; Napp, Duane ; Desantis, Charles ; Desaulnier, Willie ; Pan, Tsung-Yu ; Felton, Lawrence ; Palmer, Mark ; Rosser, Jerald ; Felty, Joe ; Vianco, Paul ; Greaves, John ; Whitten, Gordon ; Zhu, Y
Author_Institution :
Eng. Res. Center, Lucent Technol., Princeton, NJ, USA
fYear :
1999
fDate :
1-3 Feb 1999
Firstpage :
602
Lastpage :
605
Abstract :
In 1997, the National Center for Manufacturing Sciences Lead-Free Solder Project carried out by a consortium of 11 industrial corporations, academic institutions, and national laboratories completed its four year program to identify, and evaluate alternatives to eutectic tin-lead solder. The goal of the project was to determine whether safe, reliable, nontoxic and cost-effective substitutes exist for lead-bearing solders in electronics manufacturing. To find an alternative to lead in solders requires gaining knowledge equivalent to the knowledge base already in existence for lead-bearing solders. The production of durable, reliable, safe and affordable electronic products with lead-free solders requires the manufacturer to understand material properties, manufacturing processes and equipment, toxicological effects, alloy cost and long-term availability and reliability. This talk summarized the major results of this multiyear research program, including manufacturing and reliability trials, and studies of the root causes of “fillet lifting” in plated through hole joints
Keywords :
environmental factors; project engineering; soldering; Lead-Free Solder Project; USA; availability; electronic products; electronics manufacturing; eutectic tin-lead solder alternatives; fillet lifting; knowledge base; lead-free soldering; manufacturing processes; material properties; reliability; research trends; root causes; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Laboratories; Lead; Manufacturing industries; Manufacturing processes; Material properties; Materials reliability; Production; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo
Print_ISBN :
0-7695-0007-2
Type :
conf
DOI :
10.1109/ECODIM.1999.747683
Filename :
747683
Link To Document :
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