Title :
Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system
Author :
Habu, Kazutaka ; Takeda, Naoko ; Watanabe, Haruo ; Ooki, Hiroshi ; Abe, Jiro ; Saito, Takashi ; Taniguchi, Yoshikuni ; Takayama, Kinjiro
Author_Institution :
Center for Environ. Technol., Sony Corp., Yokohama, Japan
Abstract :
Environmental concerns have led the authors to develop a lead-free solder. Their observation that a small amount of Ge drastically improves solderability and reliability of SnAg alloys resulted in the development of a novel lead-free solder alloys with a composition of Sn-20Ag-4.0Bi-0.5Cu-0.1Ge. They also confirmed that the developed solder was usable in conventional soldering machines without changing operational conditions
Keywords :
bismuth alloys; copper alloys; environmental factors; germanium alloys; reliability; silver alloys; soldering; tin alloys; Sn-20Ag-4.0Bi-0.5Cu-0.1Ge lead-free solder; SnAgBiCuGe; environmental concerns; lead-free solder alloys; reliability; solderability; soldering machines; Bismuth; Copper alloys; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Mechanical factors; Pollution; Production engineering; Soldering; Tin;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo
Print_ISBN :
0-7695-0007-2
DOI :
10.1109/ECODIM.1999.747684
