Title :
Measurement analysis and improvement technique of signal integrity for high-speed connectors
Author :
Lin, Han-Nien ; Huang, Yu-Chieh ; Lin, Ming-Shan ; Kung, Tzu-Wen
Author_Institution :
Dept. of Commun. Eng., Feng-Chia Univ., Taichung, Taiwan
Abstract :
The demanding for high speed network communications explodes in recent years for Internet applications. Although the optical fibre deployed already provides broader bandwidth for high speed applications, the transceivers are still in need to convert optical signal into electrical signal for front-end of server computer. Therefore, the high speed connectors play critical roles for interconnect between optic-electric converting transceivers and server computer. In this study, we investigate the signal integrity (SI) analysis for 10 Gbps two-layered SFP+ connector with EM simulation and measurement. Since the differential pair transmission is applied to SFP+ connector, we measure its differential mode (DM) reflection and transmission coefficients with network analyser first. We then observe the variation of DM impedance and analyse the cause of impedance discontinuity by the utilization of TDR measurement. Finally, we will propose modified connecter structure by changing pin width to improve the signal integrity.
Keywords :
electric connectors; electric impedance; optical fibre networks; optical transceivers; EM simulation; Internet; TDR measurement; broader bandwidth; differential mode reflection; differential mode transmission; electrical signal; high speed applications; high speed network communications; high-speed connectors; measurement analysis; modified connecter structure; optic-electric converting transceivers; optical fibre; optical signal; server computer front-end; signal integrity analysis; signal integrity technique; two-layered SFP+ connector; Analytical models; Connectors; Frequency measurement; Impedance; Impedance measurement; Loss measurement; Time measurement; SFP (small form-factor pluggable plus); differential mode (DM); signal integrity (SI);
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1557-0
Electronic_ISBN :
978-1-4577-1558-7
DOI :
10.1109/APEMC.2012.6237837