Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Summary form only given, as follows. Due to their unique properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: an electromagnetic and a circuit model. Finally, promising experimental studies were done in order to demonstrate the principle of the CNT-based flip-chip interconnect.