DocumentCode
2594015
Title
Low deformation and stress packaging of micro-machined devices
Author
Dickerson, Terry ; Ward, Michael
Author_Institution
TWI, Cambridge, UK
fYear
1997
fDate
35487
Firstpage
42552
Lastpage
42554
Abstract
This paper reports on low deformation packaging developed for Si chips with micro-machined elements. In particular it reports on modelling that gave design guidance on the placement of the devices on the die surface
Keywords
micromachining; Si; Si chip; design; low deformation packaging; micromachined device; modelling; thermomechanical stress;
fLanguage
English
Publisher
iet
Conference_Titel
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970025
Filename
597330
Link To Document