DocumentCode
2594434
Title
Low-profile broadband Core-Isolator for multi-band module
Author
Wada, Tomotaka ; Hasegawa, T. ; Koshino, Masayoshi ; Okada, Takashi
Author_Institution
Murata Manufacturing Co., Ltd, Yasu-shi, Japan
fYear
2011
fDate
5-10 June 2011
Firstpage
1
Lastpage
1
Abstract
Summary form only given, as follows. A novel broadband Core-Isolator for modules of multi-standard and multi-band mobile handsets has been developed successfully. A new circuit configuration for extending the isolation frequency band is proposed. A 1.5 × 0.9 × 0.4 mm3 Core-Isolator with two electrodes of asymmetrical structure has been fabricated, which is mounted on a module substrate with resonant elements. It has an insertion loss of 0.5dB and an isolation of 10dB at 824–915MHz which is twice wider than conventional one.
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location
Baltimore, MD
ISSN
0149-645X
Print_ISBN
978-1-61284-754-2
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2011.5973322
Filename
5973322
Link To Document