• DocumentCode
    2594434
  • Title

    Low-profile broadband Core-Isolator for multi-band module

  • Author

    Wada, Tomotaka ; Hasegawa, T. ; Koshino, Masayoshi ; Okada, Takashi

  • Author_Institution
    Murata Manufacturing Co., Ltd, Yasu-shi, Japan
  • fYear
    2011
  • fDate
    5-10 June 2011
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given, as follows. A novel broadband Core-Isolator for modules of multi-standard and multi-band mobile handsets has been developed successfully. A new circuit configuration for extending the isolation frequency band is proposed. A 1.5 × 0.9 × 0.4 mm3 Core-Isolator with two electrodes of asymmetrical structure has been fabricated, which is mounted on a module substrate with resonant elements. It has an insertion loss of 0.5dB and an isolation of 10dB at 824–915MHz which is twice wider than conventional one.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-61284-754-2
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2011.5973322
  • Filename
    5973322