DocumentCode :
2594688
Title :
Terahertz Spectroscopy as a New Analyzing Tool for Dielectric Properties of Various Insulating Materials
Author :
Ohki, Y. ; Okada, M. ; Fuse, N. ; Iwai, K. ; Mizuno, M. ; Fukunaga, K.
Author_Institution :
Dept. of Electr. Eng. & Biosci., Waseda Univ., Shinjuku, Japan
fYear :
2008
fDate :
26-29 Oct. 2008
Firstpage :
33
Lastpage :
36
Abstract :
Several examples of terahertz (THz) spectroscopic measurement results carried out for dielectric solids are reviewed, including THz time-domain spectra of polyamide-6 composites with nm-sized clay fillers obtained by the authors. For polyamide nanocomposites, it has become clear that the dielectric loss factor shows two peaks at around 1.9 THz and 2.7 to 3.1 THz. By referring to X-ray diffraction spectra, it is assumed that the origin of the former peak is the ¿-phase crystal in polyamide, and that the nanofiller loading suppresses ¿-phase crystallization. The latter peak shifts toward a lower frequency in the nanocomposites, which indicates that the presence of strong ionic bonds between the nanofiller and the polymer matrix restrains molecular motion and increases the relaxation time. This is believed to be the main reason of superior properties of the polymer nanocomposites.
Keywords :
X-ray diffraction; crystallisation; dielectric losses; dielectric relaxation; filled polymers; insulation testing; materials testing; nanocomposites; organic insulating materials; submillimetre wave measurement; terahertz wave spectra; THz time-domain spectra; X-ray diffraction spectra; dielectric loss factor; dielectric solids; frequency 2.7 THz to 3.1 THz; insulating materials; ionic bonds; molecular motion; nm-sized clay fillers; polyamide nanocomposites; polyamide-6 composites; terahertz spectroscopy; ¿-phase crystallization; Crystallization; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Electrochemical impedance spectroscopy; Nanocomposites; Polymers; Solids; Submillimeter wave measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location :
Quebec, QC
Print_ISBN :
978-1-4244-2548-8
Electronic_ISBN :
978-1-4244-2549-5
Type :
conf
DOI :
10.1109/CEIDP.2008.4772813
Filename :
4772813
Link To Document :
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