• DocumentCode
    2595182
  • Title

    Thermogravimetric and Spectroscopy Analyses of Silicone Nanocomposites

  • Author

    Ramirez, Isaias ; Cherney, Edward A. ; Jayaram, Shesha ; Gauthier, Mario

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    249
  • Lastpage
    252
  • Abstract
    In this research, nanofillers, such as nano fumed silica, nano natural silica and nano alumina, are used to reinforce silicone rubber. The thermal degradation of the nanofilled samples are analyzed through thermal gravimetric analysis (TGA). TGA confirms that nano fumed silica imparts better heat resistance to silicone than nano natural silica or nano-alumina filler when dispersed with Tritontrade. Fourier transform infrared (FTIR) spectroscopy is used to elucidate the mechanism by which the nanofillers improve the heat and erosion resistance of silicone composites. FTIR analysis indicates a significantly higher concentration of silanol groups in the nano fumed silica filled samples than in the micro-silica filled samples. The influence of the increased number of silanol groups on the erosion resistance of the nanocomposites is discussed.
  • Keywords
    Fourier transform spectroscopy; infrared spectroscopy; nanocomposites; silicone rubber; thermal analysis; Fourier transform infrared spectroscopy; Triton; erosion resistance; heat resistance; nano alumina; nano fumed silica; nano natural silica; nanofillers; reinforce silicone rubber; silanol groups; silicone nanocomposites; spectroscopy analyses; thermal degradation; thermogravimetric analyses; Degradation; Infrared heating; Infrared spectra; Nanocomposites; Nanoparticles; Resistance heating; Rubber; Silicon compounds; Spectroscopy; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772845
  • Filename
    4772845