DocumentCode
2595911
Title
Signal integrity aware TSV positioning
Author
Ligang Hou ; Shu Bai ; Jinhui Wang ; Xiaohong Peng ; Shuqin Geng
Author_Institution
VLSI & Syst. Lab., Beijing Univ. of Technol., Beijing, China
fYear
2012
fDate
21-24 May 2012
Firstpage
825
Lastpage
828
Abstract
In this paper, a signal integrity aware TSV positioning method (SITP) is introduced. Grounded TSV proved to help eliminating TSV-to-TSV coupling. A trench based 3D IC placement method is developed, transforming 2D placement into 3D placement and perform signal TSV placement with flexible grounded TSV Insertion. IBM placement benchmark is used for original 2D placement. By evaluating wire-length and runtime, SITP automatically achieve high performance 3D IC placement with considerable TSV-TSV interference elimination.
Keywords
integrated circuit interconnections; three-dimensional integrated circuits; 2D placement; 3D IC placement method; IBM placement benchmark; SITP; TSV-to-TSV coupling; flexible grounded TSV Insertion; grounded TSV; interconnect delay reduction; signal TSV placement; signal integrity aware TSV positioning; Analytical models; Capacitance; Couplings; Integrated circuit modeling; Metals; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location
Singapore
Print_ISBN
978-1-4577-1557-0
Electronic_ISBN
978-1-4577-1558-7
Type
conf
DOI
10.1109/APEMC.2012.6237990
Filename
6237990
Link To Document