DocumentCode
2596983
Title
Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI
Author
Nimura, Masatsugu ; Sakuma, Katsuyuki ; Ogino, Hiroshi ; Enomoto, Tomoyuki ; Shigetou, Akitsu ; Shoji, Shuichi ; Mizuno, Jun
Author_Institution
Waseda Univ., Tokyo, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
81
Lastpage
81
Abstract
This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.
Keywords
adhesive bonding; integrated circuit bonding; large scale integration; three-dimensional integrated circuits; 3D LSI; bump surface; chip bonding; hybrid solder-adhesive bonding; narrow gap; resin planarization technique; three dimensional large scale integrated circuit; Bonding; Large scale integration; Planarization; Resins; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238052
Filename
6238052
Link To Document