DocumentCode :
2597185
Title :
Transient characteristics of BCB encapsulated surface micromachined aluminum micro-mechanical resonators
Author :
Pamidighantam, Sudhakar
Author_Institution :
Indian Inst. of Sci., Supercomput. Educ. & Res. Center, Bangalore, India
fYear :
2004
fDate :
8-10 Dec. 2004
Firstpage :
177
Lastpage :
182
Abstract :
In this contribution, the transient characteristics of benzo cyclo butene (BCB) encapsulated aluminum (Al) micro mechanical resonators as a function of time varying pressure are studied. The quality factor of encapsulated Al resonator showed a drastic change with time of more than 200% reduction. The estimated transient leak rate spans over several orders of magnitude (105 to 10-9 atm cm3 s-1). A theoretical description of Al micro mechanical resonator and the leak rate are presented. Possible causes for the leak rate and the potential solutions are also outlined.
Keywords :
aluminium; encapsulation; micromachining; micromechanical resonators; surface treatment; transient analysis; Al; benzo cyclo butene; encapsulated Al resonator; micromachined Aluminium resonator; time varying pressure; transient characteristics; transient leak rate; Aluminum; Artificial intelligence; Electronic components; Electronics packaging; Microelectromechanical devices; Micromechanical devices; Q factor; Radiofrequency microelectromechanical systems; Supercomputers; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
Type :
conf
DOI :
10.1109/EPTC.2004.1396599
Filename :
1396599
Link To Document :
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