DocumentCode
2597590
Title
Low temperature bonding with metallic micro-cones for 3D integration
Author
Chen, Zhuo ; Lu, Qin ; Hang, Tao ; Hu, Anmin ; Li, Ming
Author_Institution
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2012
fDate
22-23 May 2012
Firstpage
177
Lastpage
177
Abstract
A novel low temperature bonding method for potential use in 3D integration is reported in this paper. Metallic (Ni and Cu) micro-cones arrays fabricated by one step electroplating were utilized to bond with solder bumps with appropriate temperature and pressure. The bonding strength of this unique architecture was evaluated by shear testing with results comparable to reflow soldering.
Keywords
bonding processes; copper; electroplating; nickel; reflow soldering; solders; 3D integration; Cu; Ni; bonding strength; electroplating; low temperature bonding method; metallic micro-cones arrays; reflow soldering; shear testing; solder bumps; Bonding; Educational institutions; Microelectronics; Nickel; Solids; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238085
Filename
6238085
Link To Document