DocumentCode
2598056
Title
Stencil printing at sub-100 microns pitch
Author
Desmulliez, M.P.Y. ; Kay, R.W. ; Stoyanov, S. ; Bailey, C.
Author_Institution
Sch. of Eng. & Phys. Sci., Heriot Watt Univ., Edinburgh, UK
fYear
2004
fDate
8-10 Dec. 2004
Firstpage
354
Lastpage
358
Abstract
This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil arc presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.
Keywords
adhesive bonding; chip scale packaging; conducting materials; fine-pitch technology; integrated circuit interconnections; printing; solders; 100 micron; bonding technology; conductive adhesive; lead-free solder pastes; microengineered stencil arc; print deposits; stencil printing; sub-100 microns pitch; Apertures; Conductive adhesives; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Packaging machines; Printing; Surface resistance; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN
0-7803-8821-6
Type
conf
DOI
10.1109/EPTC.2004.1396633
Filename
1396633
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