DocumentCode :
2598173
Title :
Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D
Author :
Carchon, G. ; Monaco, O. Di ; Vaesen, K. ; Brebels, S. ; De Raedt, W. ; Nauwelaers, B.
Author_Institution :
div. ESAT-TELEMIC, Katholieke Univ., Leuven, Belgium
fYear :
2000
fDate :
2000
Firstpage :
167
Lastpage :
170
Abstract :
We report on the design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D. Using 3-D simulations, it is shown that, for analysis purposes, the vertical metal wall, can be replaced with a thin (5 μm) metal layer with only a small impact on the actual performance. This equivalent structure can be more easily fabricated as the thin metal layer on the top is directly available in the multi-layer technology. This allows for a faster design and characterization of the feedthrough. The transmission line properties (characteristic impedance and propagation constant) of the intrinsic feedthrough are extracted based on the measurement of two equivalent lines with different length. Measurements indicate that a low-loss (<0.4 dB), well matched feedthrough (return loss below -25 dB) can be realized up to at least 50 GHz (feedthrough length of 500 μm)
Keywords :
S-parameters; coplanar waveguides; losses; microwave circuits; millimetre wave circuits; multichip modules; thin film circuits; transmission line theory; waveguide transitions; -25 dB; 0.4 dB; 3D simulations; 5 micron; 50 GHz; CPW feedthroughs; characteristic impedance; characterization; multi-layer thin-film MCM-D; propagation constant; transmission line properties; Circuits; Coplanar waveguides; Costs; Dielectric losses; Dielectric substrates; Impedance; Packaging; Spirals; Transistors; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio and Wireless Conference, 2000. RAWCON 2000. 2000 IEEE
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-6267-5
Type :
conf
DOI :
10.1109/RAWCON.2000.881881
Filename :
881881
Link To Document :
بازگشت