Title :
A simple test structure for measuring substrate resistivity
Author :
Orchard-Webb, J.H. ; Cloutier, Reynald
Author_Institution :
Mitel Semicond., Bromont, Que., Canada
Abstract :
A simple test structure for measuring the substrate resistivity of silicon integrated-circuit wafers is described. The primary application is for process validation modules, but, as the structure is very small and needs only one pad, it can also be placed on circuit chips or in the scribe lanes. The performance of the structure is evaluated for a production environment, and some applications for solving production and development problems are described.
Keywords :
electrical conductivity measurement; integrated circuit testing; process control; production testing; substrates; Si; circuit chips; development problems; integrated-circuit wafers; process validation modules; production environment; resistivity measurement; scribe lanes; substrate resistivity; test structure; Circuit testing; Conductivity; Contact resistance; Electric resistance; Electrical resistance measurement; Integrated circuit measurements; Integrated circuit testing; Production; Semiconductor device measurement; Silicon;
Conference_Titel :
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Print_ISBN :
0-87942-714-0
DOI :
10.1109/ICMTS.1989.39304
